Electrolube provides its customers with a comprehensive range of products with high thermal conductivity for heat management in electronic systems. These products include silicone and silicone free pastes and greases and epoxy resins. The benefits of the Electrolube Thermal Protection systems include: cost effective improvements in system reliability, more consistent performance, reduced failure rates and less vibration. Packaging includes syringes, tubes, twin packs, and bulk containers.

Product Code

HTC

Silicone-free Heat Transfer Compound
Silicone-free thermal pastes. Excellent non-creep characteristics. Excellent thermal conductivity 0.9 W/mk. Easy and economical to use. Now available in aerosol form (HTCA).

HTS

Silicone Heat Transfer Compound
Silicone based heat transfer pastes. Excellent non-creep characteristics. Superior thermal conductivity 0.9 W/mk. Wide operating temperature range -50°C to +200°C with low evaporation weight loss. Easy and economical to use.

HTCP

Silicone-free Heat Transfer Compound
Silicone-free thermal pastes.
Excellent non-creep characteristics.
Excellent thermal conductivity 2.5 W/mk.
Easy and economical to use.

HTSP

Silicone Heat Transfer Compound
Silicone based heat transfer pastes.
Excellent non-creep characteristics.
Superior thermal conductivity 3.0 W/mk. Wide operating temperature range -50°C to +200°C with low evaporation weight loss. Easy and economical to use.

TCR

Thermally Conductive RTV
Silicone RTV with high thermal conductivity (2.0 W/mk).
Operates from -50°C to +230°C.
Cures in 24 hours at room temperature or 45 minutes at 100°C.

TBS

Thermal Bonding System
Two part epoxy bonding system with a thermal conductivity of 1.1 W/mk.
Eliminates need for mechanical fixings by providing a permanent bond.